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Saturday, November 23, 2024

Peoria City Council Approves Development Agreement for Amkor Technology’s Semiconductor Facility

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City of Peoria | City of Peoria website

City of Peoria | City of Peoria website

The Peoria City Council has given the green light to a Development Agreement with Amkor Technology, paving the way for the establishment of a cutting-edge semiconductor packaging and test campus in the city. The agreement, approved at a recent council meeting, will see Amkor making a significant investment in Peoria, creating 2,000 new local jobs.

Mayor Jason Beck expressed his pride in Peoria's involvement in expanding semiconductor manufacturing in the United States, stating, "Amkor is a great partner that will bring high-quality jobs and products to our community." Giel Rutten, Amkor’s president and chief executive officer, also highlighted the importance of this project, stating, "Amkor’s new facility in Peoria represents a pivotal milestone in advancing semiconductor manufacturing within the United States."

Mark Hammons, general manager of Vistancia, where the facility will be located, expressed excitement about the project, stating, "We are thrilled Amkor Technology has selected FIVE NORTH at VISTANCIA’s employment core as its future home for their advanced semiconductor packaging and testing campus, bringing 2,000 new jobs to North Peoria."

The Arizona Commerce Authority and the Greater Phoenix Economic Council were among the key partners supporting the project. Sandra Watson, President and CEO of the Arizona Commerce Authority, commented, "Amkor’s facility will anchor leading edge semiconductor packaging operations in Arizona and the United States, providing a major boost for jobs and supply chain security." Chris Camacho, President & CEO of the Greater Phoenix Economic Council, emphasized the significance of the partnership, stating, "Coordination like this between public, private and regional partners is how cities evolve and livelihoods grow."

Amkor’s plans for the Peoria facility aim to provide advanced technologies for semiconductor packaging and testing, catering to markets such as high-performance computing, automotive, and communications.

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